![]() ![]() Orders are shifting to Pixart, Silicon Optronics (SOI), Sunnic Group and other Taiwan-based vendors. Global CMOS leaders Sony and OmniVision are under-supply. Huawei and other Chinese brands are pulling in volume, causing the shortage of CMOS chipset. Early 2018, Mainland China high-end lens and motor are facing shortage situation. ( OLED-Info, Fraunhofer FEP, Elecfans)Ĭost up and shortage situation is now spreading to CMOS image sensor components segment. This could enable a new way to produce direct-emission OLED micro-displays, which will be more efficient and bright compared to the current ones that use color filters. ( UDN, CN Beta)įraunhofer FEP institute has developed a new micro-patterning process using an electron beam to produce OLED micro-displays on silicon substrates. The smart bus stop signs are based on APEP’s public transportation system solution and E Ink’s e-paper technology. ( Digitimes, press, Digitimes)Į Ink has announced collaboration with AOMA Technology (APEP) pushing smart bus-stop signs in Shanghai. However, maturing technological development for mini LED is offering business opportunities. Demand for LED products has remained weak since 1H18, and has not yet rebounded in 3Q18 despite it being the traditional high season. Major LED firms in Taiwan and China have made ambitious moves developing mini LED devices for backlighting applications and displays, with the focus of competition expected to swing from product offerings in 2H18 to production cost in 2019. ( GizChina, Android Authority, Phone Arena, iFanr, CN Beta) OPPO is reportedly going to be the first company to use the brand new P80 and P90 in their upcoming mid-range smartphones. ![]() MediaTek is to unveil Helio P80 and P90 in the coming months. MediaTek is allegedly developing successor of Helio P60. ![]() ( GizChina, Winfuture, My Drivers, IT Home, Sina) Instead, Qualcomm will include a Snapdragon X24 model with support for Cat. SM1850 may likely not have an integrated 5G modem. The SoC will measure 12.4×12.4 mm and will be a 7nm chipset manufactured by TSMC. Qualcomm Snapdragon 855 (SDM855) codenamed “Hena”, which will succeed the current Snapdragon 845 flagship, is now being referred to as the SM8150. ( Android Authority, WinFuture, XDA Developers) The next Qualcomm Snapdragon chipsets for mobile devices will likely be 12.4×12.4mm silicon built on Taiwan Semiconductor Manufacturing Company’s (TSMC) 7nm process node using optical lithography. Qualcomm’s upcoming Snapdragon mobile chipset for 2019 reportedly might have a dedicated Neural Processing Unit (NPU). ![]()
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